Fluss tal-proċess tas-sottostrat tal-aluminju

1. Ftuħ

Proċess ta 'produzzjoni tas-sottostrat tal-aluminju

1. Il-proċess tat-tqattigħ tal-materjal - qtugħ

2. L-iskop tal-ftuħ

Aqta' materjali ta' daqs-kbir li jidħlu għad-daqs meħtieġ għall-produzzjoni

3. Prekawzjonijiet għall-materjali tal-ftuħ

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Tħaffir

1. Proċess tat-tħaffir

Doweling - Tħaffir - Bord ta' Spezzjoni

2. Għan tat-tħaffir

Pożizzjonament u tħaffir tal-pjanċa biex tassisti l-proċess ta 'produzzjoni sussegwenti u l-assemblaġġ tal-klijent

3. Prekawzjonijiet għat-tħaffir

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

It-tieni drill: toqba tal-għodda fl-unità wara l-maskra tal-istann

3. Immaġini tal-film niexef/imxarrab

1. Proċess tal-immaġini tal-film niexef/imxarrab

Pjanċa tat-tħin - film - espożizzjoni - żvilupp

2. Għan ta 'immaġini ta' film niexef/imxarrab

Il-partijiet meħtieġa biex isir iċ-ċirkwit huma mogħtija fuq il-folja

3. Prekawzjonijiet għall-immaġini tal-film niexef/imxarrab

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Inċiżjoni Aċidu/Alkalina

1. Proċess ta 'inċiżjoni aċidu/alkalin

Inċiżjoni - tqaxxir - tnixxif - bord ta' spezzjoni

2. Għan ta 'inċiżjoni aċidu/alkalin

Wara l-immaġini tal-film niexef/imxarrab, żomm il-parti meħtieġa taċ-ċirkwit, neħħi l-parti żejda barra ċ-ċirkwit, u tagħti attenzjoni lill-korrużjoni tas-sottostrat tal-aluminju bis-soluzzjoni tal-inċiżjoni waqt l-inċiżjoni tal-aċidu;

3. Prekawzjonijiet għall-inċiżjoni bl-aċidu/alkalin

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Ħames, maskra tal-istann tal-iskrin tal-ħarir, karattri

1. Maskra tal-istann tal-iskrin tal-ħarir, proċess tal-karattru

Silkscreen - Qabel-ħami - Espożizzjoni - Żvilupp - Karattri

2. L-iskop tal-maskra tal-istann tal-iskrin tal-ħarir u l-karattri

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Kwistjonijiet li jeħtieġu attenzjoni għall-maskra u l-karattri tal-istann tal-iskrin tal-ħarir

① To check whether there is garbage or foreign matter on the board

Sostrat tal-aluminju COB

Sostrat tal-aluminju COB

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-QATGĦA, bord tal-gong

1. V-QATGĦA, proċess tal-bord tal-gong

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, l-iskop tal-bord tal-gong

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Prekawzjonijiet għal V-CUT u bord tal-gong

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Seba, test, OSP

1. Test, proċess OSP

Test tal-Linja - Test tal-Vultaġġ Reżistrat - OSP

2. Ittestjar, l-iskop ta 'OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, ittestjar, prekawzjonijiet OSP

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Tmienja, FQC, FQA, ippakkjar, tbaħħir

1. Proċess

FQC - FQA - Ippakkjar - Ġarr

2. Għan

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Oqgħod attent

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3