X'inhu Bord taċ-ċirkwit HDI

Bord ta 'ċirkwit HDI huwa l-abbrevjazzjoni Ingliża ta' High Density Interconnector. Il-manifattura ta 'Interkonnessjoni ta' Densità Għolja (HDI) hija waħda mill-oqsma li qed jikbru malajr fl-industrija tal-bord taċ-ċirkwit stampat.

Deskrizzjoni tal-prodott

HDI is the English abbreviation of High Density Interconnector, and high-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From HP's first 32-bit computer in 1985, to today's large client servers with 36 sequentially laminated multi-layer printed boards and stacked micro-vias, HDI/micro-via technology is undoubtedly the PCB architecture of the future. Larger ASICs and FPGAs with smaller device pitches, more I/O pins, and embedded passives have increasingly shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, driving demand for Strong demand for HDI/micro vias. HDI process

L-ewwel-proċess ta' ordni: 1 flimkien N u 1

It-tieni-proċess tal-ordni: 2 flimkien N u 2

Proċess bi tliet-stadji: 3 flimkien N u 3

Proċess tar-raba-livell: 4 flimkien N u 4