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Wiring method of PCB multilayer board

Mar 02, 2022

Four-layer circuit board wiring method 5: Generally speaking, a four-layer circuit board can be divided into top layer, bottom layer and two middle layers. The top layer and the bottom layer are connected to the signal line. The middle layer firstly uses ADD PLANE to add INTERNAL PLANE1 and INTERNAL PLANE2 through the command DESIGN/LAYER STACK MANAGER as the most used power layers such as VCC and ground layers such as GND (that is, connect the corresponding network labels. Note Do not use ADD LAYER, which will increase MIDPLAYER, which is mainly used for multi-layer signal line placement), so that PLNNE1 and PLANE2 are two layers of copper connecting power VCC and ground GND. If there are multiple power sources such as VCC2, etc. or ground layers such as GND2, etc., first use a thicker wire or fill FILL in PLANE1 or PLANE2 (at this time, the copper skin corresponding to the wire or FILL does not exist, and the wire or FILL can be clearly seen against the light. Fill) to delineate the general area of the power supply or ground (mainly for the convenience of the PLACE/SPLIT PLANE command later), and then use PLACE/SPLIT PLANE to demarcate the area in the corresponding area of INTERNAL PLANE1 and INTERNAL PLANE2 (ie VCC2 copper and GND2 copper sheet, there is no VCC in this area in the same PLANE) (note that different network surfaces in the same PLANE should not overlap as much as possible 5. Let SPLIT1 and SPLIT2 overlap two pieces in the same PLANE, and SPLIT2 is in SPLIT1 Internally, the two blocks will be automatically separated according to the border of SPLIT2 during plate making (SPLIT1 is distributed on the periphery of SPLIT). Just be careful that the pads or vias in the same net table as SPLIT1 when overlapping do not try to connect with SPLIT1 in the area of SPLIT2. no problem). At this time, the vias in this area are automatically connected to the corresponding copper layers of this layer, and the device pins that pass through the upper and lower boards, such as DIP package devices and connectors, will automatically get out of the way of the PLANE in this area. Click DESIGN/SPLIT PLANES to view each SPLIT PLANES